MESA® product family of advanced flatness semiconductor wafer chucks and wafer tables.
MESA® technology will control flatness and surface finish of wafer handling components to tighter tolerances than previously available.
The new product family provides significant performance advantages to equipment manufacturers for the production of next generation integrated circuits. Incorporating M Cubed’s engineered materials and processing technologies, the MESA® product family represents a step-function improvement of the existing wafer chuck product portfolio enabled by advanced finishing techniques for extreme wafer surface flatness specifications. These combined functional advantages will enable more precise overlay and focus requirements as well as more precise and detailed defect detection for advanced semiconductor equipment applications.
According to M Cubed Technologies’ General Manager, Brian Monti, “We are very pleased to announce this first in a series of product releases for our flagship MESA® product family. These wafer chucks and wafer tables are ideally suited for advanced 300mm semiconductor equipment applications including Lithography, Metrology, and Wafer Inspection and is scalable to future requirements for both 300mm and 450mm platforms. Additional releases are planned as we continue to meet the industry drive to incorporate small features with greater complexity into semiconductor chip designs while deploying fab tools with an ever improving cost of ownership. Our line of MESA® products will be sold directly to M Cubed OEM customers with shipments starting in the second quarter of 2014.”
The MESA® products are available in a wide range of customer specified configurations. For more information about this new product, contact M Cubed Technologies or visit www.mmmt.com.